Advanced Copper-Gold Wire-Stud Interconnection Technologies

Advanced Copper-Gold Wire-Stud Interconnection Technologies by John Lau, Hong Meng Ho

ISBN10: 0071785167
ISBN13: 978-0071785167
Author: John Lau, Hong Meng Ho
Title: Advanced Copper-Gold Wire-Stud Interconnection Technologies
Publisher: McGraw-Hill Professional; 1 edition (September 22, 2012)
Language: English
Size ePub: 1562 kb
Size PDF: 1522 kb
Rating: 4.8/5
Votes: 451
Pages:
Subcategory: Engineering

Advanced Copper-Gold Wire-Stud Interconnection Technologies by John Lau, Hong Meng Ho



Develop semiconductor chips for low-cost, high-performance electronic products using copper wire, copper stud, and gold stud bonding

Advanced Copper-Gold Wire-Stud Interconnection Technologies covers the latest advances in using low-cost copper wire, copper stud, and gold stud bonding techniques for the semiconductor chips used in today’s electronic products.

Take advantage of the cost effectiveness and performance efficiency of copper and gold studs and maximize their use in 2D and 3D IC packaging and 3D IC integration system-in-package (SiP) using the cutting-edge bonding techniques in this professional guide.

Advanced Copper-Gold Wire-Stud Interconnection Technologies

  • Covers newest advances in interconnection bonding technologies, including Cu stud, Au stud bonding, and Cu wire bonding
  • Includes details on conventional gold wire bonding technologies
  • Discusses 2D and 3D IC packaging, 3D IC integration system-in-package (SiP), and flip-chip formats
  • Provides context for those choosing robust, reliable, high-performance, and cost-effective packaging and 3D IC integration techniques for their Cu/Au wire/stud interconnected electronic and optoelectronic products

Comprehensive coverage:
Introduction to Semiconductor and Packaging Technologies; Conventional Au Wire Bonding; Conventional Au Stud Bumps; Cu Wire Bonding Problems; Ultrasonic Bonding Systems and Technologies of Cu Wire Bonding; Bonding Wire Metallurgy and Characteristics that Can Affect Bonding, Reliability, or Testing of Cu Wire Bonding; Process Technology Affecting Cu Wire Bonding; Cu Wire Bond Testing; Cu-Al Intermetallic Compounds and Other Metallic Interface Reactions in Cu Wire Bonding; The Effect of Plating, Bond Pad Technology and Reliability on Cu Wire Bonding; Cleaning to Improve Bondability and Reliability of Cu Wire Bonding; Mechanical Problems in Cu Wire Bonding; Advanced and Specialized Wire Bonding Technologies when using Cu Wire Bonding; Overview of Materials and Material Science of Cu/Low K Devices that Affect Cu Wire Bonding and Packaging; Overview of Process Modeling and Simulation on Cu Wire Bonding; Package Level Reliability of Cu Wire Bonded Device; Cu Stud Bonding


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